1. Physical Vapour Deposition (PVD) System

HPVT offers Vacuum PVD Systems for Laboratory, R&D sectors and Industrial Purpose. Essentially there are Different types of PVD.

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2. Vacuum Coating Unit

HPVT VACUUM COATING UNIT can perform a large number of industrial and laboratory applications like preparation of thin films for optical and electronic applications, preparation of specimens for Electron Microscope, Semiconductor, Solar Cells etc.

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3. Thermal Evaporation System

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4. RF & DC Sputtering System

Sputtering is a widely used and highly versatile vacuum coating system used for the deposition of a variety of coating materials. Sputtering Deposition Systems use high energy particles as a way of transferring kinetic energy to a target in order to remove material for deposition. For sputtering, the energized particles are present as a glow diffuse plasma.

HPVT HPVT manufactures different size cathodes from 1" to 4". Our cathodes are flexi mount with confocal arrangement. Magnetrons have capability of accommodating 1-6 mm thick targets.

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5. E-Beam Evaporation System

E-beam Evaporation is a process similar to thermal evaporation i.e. a source material is heated above its boiling / sublimation temperature and evaporated to form a film on the surfaces that is stroke by the evaporated atoms.

The electron beam only heats the source material and not the entire crucible, a lower degree of contamination from the crucible will be present than in the case of thermal evaporation.

Advantage of e beam evaporation over thermal evaporation is the possibility to add a larger amount of energy into the source material. This yields a higher density film with an increased adhesion to the substrate.

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6. Sputter Coater (SEM Coater)

A Desk Sputter Coater 150A for SEM is a sample preparation instrument that deposits a thin, conductive metal film (like gold, silver, platinum, or palladium) onto non-conductive specimens to prevent charging, improve image quality, and protect against the electron beam.

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7. Pulse Laser Deposition (PLD) System

Pulsed Laser Deposition (PLD) is a thin film deposition (specifically a Physical Vapor Deposition - PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in high vacuum chamber or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

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